Gold Plating
Ensuring uniform and adherent gold deposits often requires the use of a strike gold. The choice of strike gold depends on the substrate and the subsequent gold process.
|
Electrolytic Gold Strike
|
Cu or NI Substrate
|
Stainless Steel
|
Pure Gold
|
Alloy
|
|---|---|---|---|---|
| AURALL™ 364 Strike | ✓ | ✓ | ||
| AURO STRIKE™ GP-3 | ✓ | ✓ | ||
| AURO STRIKE™ SAG | ✓ | ✓ |
PCCI offers a wealth of pure or alloyed gold products providing cost and performance advantages for electronic component finishing applications.
|
Electrolytic Gold
|
Cobalt
|
Nickel
|
Low Speed
|
High Speed
|
|---|---|---|---|---|
| RONOVEL™ N | ✓ | ✓ | ✓ | |
| AURONAL™ MRC | ✓ | ✓ | ✓ | |
| RONOVEL™ C | ✓ | ✓ | ✓ | |
| RONOVEL™ / AUROSPEED™ CM | ✓ | ✓ | ✓ | |
| RONOVEL™ CM-97 | ✓ | ✓ | ||
| RONOVEL™ CM AI XP | ✓ | ✓ | ||
| RONOVEL™ CS-200 | ✓ | ✓ | ||
| RONOVEL™ LB-300 | ✓ | ✓ | ||
| AURONAL™ 44BC | ✓ | ✓ | ||
| DECRONAL™ 380 | ✓ | ✓ |