Electroless Nickel and Copper
The seed layer is a critical element in delivering the coverage, adhesion, aspect and subsequent process integration.
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Electroless Nickel
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Seed Layer
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Engineering Layer
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Low P Alloy (<6%)
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Med P Alloy (7-10)
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High P Alloy (>10%)
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Boron Nickel
|
Pb & Cd Free
|
|---|---|---|---|---|---|---|---|
| NIPOSIT™ PM 988 | ✓ | ✓ | ✓ | ||||
| OMNISHIELD™ 1580 | ✓ | ✓ | |||||
| RONAMAX™ SR | ✓ | ✓ | |||||
| DURAPOSIT™ MF-1110 | ✓ | ✓ | ✓ | ||||
| DURAPOSIT™ SMT88 | ✓ | ✓ | |||||
| DURAPOSIT™ MF-0820 | ✓ | ✓ | ✓ | ||||
| NIPOSIT™ 468 | ✓ | ✓ |
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Electroless Copper
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Low Build
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High Build
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Full Build
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Self Accelerating
|
EDTA
|
Tartrate
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|---|---|---|---|---|---|---|
| CUPOSIT™ 328L | ✓ | ✓ | ||||
| CUPOSIT™ 253 | ✓ | ✓ | ||||
| CIRCUPOSIT™ 880 | ✓ | ✓ | ✓ | |||
| CIRCUPOSIT™ 3350-1 | ✓ | ✓ | ✓ | ✓ | ||
| CIRCUPOSIT™ 4500 | ✓ | ✓ | ✓ | ✓ | ||
| CUPOSIT™ 71HS | ✓ | ✓ |